| Type | Application | Main alloy | Request |
| Semiconductor | Preparation of core materials for integrated circuits | W. Tungsten titanium (WTI), Ti, Ta, Al alloy, Cu, etc., with a purity of more than 4N or 5N | Highest technical requirements, ultra-high purity metal, high precision size, high integration |
| Screen Display | Sputtering technology ensures uniformity of film production, improves productivity and reduces cost | Niobium target, Silicon target, Cr target, molybdenum target, MoNb, Al target, Aluminum alloy target, Copper target, Copper alloy target | High technical requirements, high-purity materials, large material area and high degree of uniformity |
| Decorate | It is used for coating on the surface of products to beautify the effect of wear resistance and corrosion resistance | Chromium target, titanium target, zirconium (Zr), nickel, tungsten, titanium aluminum, CRSI, CrTi, cralzr, stainless steel target | mainly used for decoration, energy saving, etc |
| Tooling | Strengthen the surface of tools and moulds, improve the service life and the quality of manufactured parts | TiAl target, Cr Al target, Cr target, Ti target, tin, tic, Al203, etc | High performance requirements and long service life |
| Solar photovoltaic | Sputtered thin film technology for the fabrication of the fourth generation thin film solar cells | Zinc aluminum oxide target, zinc oxide target, zinc aluminum target, molybdenum target, cadmium sulfide (CDS) target, copper indium gallium selenium, etc | Wide Application |
| Electronic accessories | For film resistance and film capacitance | NiCr target, NiCr target, Cr Si target, Ta target, NiCr Al target, etc | Small size, good stability and small resistance temperature coefficient are required for electronic devices |
| Information storage | For making magnetic memory | Cr based, Co based, CO Fe based, Ni based alloys | High storage density, high transmission speed |
