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JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten Alloy , Tungsten copper , Titanium , Zirconium, Vanadium, Hafnium, Sputtering target , Nobel
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Low Density Molybdenum Copper Alloy Plate For Electronic Components

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Low Density Molybdenum Copper Alloy Plate For Electronic Components

Brand Name : JINXING

Model Number : Molybdenum Copper Alloy

Certification : ISO 9001

Place of Origin : China

MOQ : 1kg

Price : 30~150USD/kg

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 10000kgs/M

Delivery Time : 10~25 work days

Packaging Details : Plywood Case

Material : Molybdenum Copper Alloy

Standard : ASTM, AMS

Size : Customized

Type : MoCu15~MoCu50

Surface : Mirror bright

Density : 9.54~10g/cm3

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Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525

Description

Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate

Type Mo Wt% Cu Wt% g/cm3 W/(M.K)
(10-6/K)
Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
Mo80Cu20 801 Balance 9.9 170 - 190 7.7
Mo70Cu30 701 Balance 9.8 180 - 200 9.1
Mo60Cu40 601 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5
Material Notes: Characteristics:
  • High thermal conductivity
  • Low thermal expansion
  • Low density
Applications:
  • Electronic components - passive cooling elements
  • Automotive industry - carrier plates for IGBT modules in electric drives

Related

  • Molybdenum Copper Wafer substrate

  • Molybdenum Copper Heat sink

  • Molybdenum Copper Rod

Low Density Molybdenum Copper Alloy Plate For Electronic Components


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